JPS5965546U - 樹脂密封型半導体装置 - Google Patents

樹脂密封型半導体装置

Info

Publication number
JPS5965546U
JPS5965546U JP1982159987U JP15998782U JPS5965546U JP S5965546 U JPS5965546 U JP S5965546U JP 1982159987 U JP1982159987 U JP 1982159987U JP 15998782 U JP15998782 U JP 15998782U JP S5965546 U JPS5965546 U JP S5965546U
Authority
JP
Japan
Prior art keywords
lead wire
resin
semiconductor chip
semiconductor device
heat radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982159987U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6246268Y2 (en]
Inventor
石川　才司
一夫 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1982159987U priority Critical patent/JPS5965546U/ja
Publication of JPS5965546U publication Critical patent/JPS5965546U/ja
Application granted granted Critical
Publication of JPS6246268Y2 publication Critical patent/JPS6246268Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1982159987U 1982-10-22 1982-10-22 樹脂密封型半導体装置 Granted JPS5965546U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982159987U JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982159987U JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Publications (2)

Publication Number Publication Date
JPS5965546U true JPS5965546U (ja) 1984-05-01
JPS6246268Y2 JPS6246268Y2 (en]) 1987-12-12

Family

ID=30352023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982159987U Granted JPS5965546U (ja) 1982-10-22 1982-10-22 樹脂密封型半導体装置

Country Status (1)

Country Link
JP (1) JPS5965546U (en])

Also Published As

Publication number Publication date
JPS6246268Y2 (en]) 1987-12-12

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